MAC Meeting 15 July 2026

https://indico.cern.ch/event/1709387/

Here are notes from today's meeting. I think the biggest takeaway is that NTU downgraded 25 of 300 modules after thermal cycling, possibly due to the assembly process (related to PUT). UCSB is not having the same problem with their partial modules. If you are not receiving these MAC meeting announcements, be sure to sign up for the E-groups after activating your CERN account. This might take some time, but I am happy to send some screenshots when needed.

Update on grading and QC code (Andrew) Good feedback on "ohmic" module grading - only call a module broken if known to be cracked

Finding Break Down Voltage (NTU Yeh-Chi Lin) Discusses fitting IV curves and plans for making a script

Database Announcement (Sindhu) Recent updates, including module grading moved to testing GUI

TTU (Sonaina) Thermal cycling modules and production on hold (basically the same as us) QTY 161 thermal cycled and ready to ship(?)

CMU (Christian) Notes from yesterday Zoltan question about 320MLF3TCCM0278, is the module broken after cooling? Jeremy suggests fixing equipment problem (cables) before making any conclusions Joe: How many modules to thermal cycle? We want to thermal cycle all modules continuous, even modules that were cycled without automated script previously (QTY 261 V3C/D at CMU)

IHEP (Han Wang) Will ship QTY 300 modules soon QTY 23 downgraded to C, QTY 6 went from A to B, and QTY 2 damaged after thermal cycling

NTU (Hsin-Wei Hsia, Lian-Sheng Tsai) Concentrating on assembling partials Working on removing noise from IV curves in MMTS New algorithm takes time, do they need a timeout?

TIFR (Kamesh) Assembling modules and researching shipping logistics

UCSB (Chiara) Thermal cycling and shipping modules Joe: reminder to ship Ti to CERN first, not KIT Jeremy: question if UCSB has same problem as NTU for downgrading during thermal cycling - NTU is currently troubleshooting and thinks it is isolated to a particular PUT (suction, grounding?), NTU confident that this is related to assembly because position during assembly seems to be a factor