MAC Meeting 3 June 2026
https://indico.cern.ch/event/1693445/
- Will get some CuW baseplates from IHEP … not clear where
- Will get some Ti baseplates end of June
Baseplates
- Soon (End of month) will not be constrained by input materials
- TI delamination
- Cannot reproduce at KIT
- What kind of QC happens before the baseplates are marked as good to ship ?
More Ti plates coming in the end of June
Understand depletion voltage
UCSB
- We have eliminated reception tests of hexaboards
- We have dropped individual module “post encapsulation” testing prior
to thermal cycling and are now using the MMTS’s first IV before cooling down as first module test after encapsulation