MAC Meeting 8 October 2025

Some key takeaways from today's meeting:

Goals for the remainder of 2025

3 month delay in projected milestones
more regularly scheduled meetings to focus on technical details as ramp-up progresses
possibly separate US and Asia MAC meetings due to time zone differences
Communication with other MACs is crucial - if you see a problem, say something because other MACs may run into the same issues

CuW modules from IHEP being sent to CERN first then to US - IHEP currently working on paperwork for shipping to CERN, ETA still unknown
Refer to IHEP CuW notes Slide 11 for examples of "bad" baseplates
KIT - QTY 120 Ti BPs possibly ship as early as end of next week, logistics are an obstacle

End of October is earliest we could receive baseplates

New pass/fail criteria for wire bonding, please review (especially Jacques and I)
I will update the wire bonding programs tomorrow or Friday
Don't backside bond, flip, frontside bond, then do all encapsulation like IHEP - flipping without encapsulation is risky
Guidance on visual inspections
More discussion on Mattermost wire bonding/encapsulation channel to come
Some good reminders: use preseries sensors, use correct module labels, throw away old labels, ship modules to CAFs when done

Confirmed so far that no differences for V3D and V3E compared to V3C for testing
No questions

working on 8 modules per day
working with IT for outside network access
received some MMTS parts but not assembled yet
good offsets for recent modules with 3 having bad IV curves (but maybe not really?)
Apparent warping during thermal cycling

Damaged protomodule due to Z axis not homed during survey - CMU OGP prompts user to home axes when loading software, we haven't had this issue
Currently investigating alignment issues
Modules testing well
OGP getting set up - we sent a link recently to our OGP GitHub that includes training and surveys
Setting up MMTS and hiring new personnel
30 minutes or less to wire bond: this includes startup/warmup and actual runtime, which is consistent with CMU

Takes 6-7 hours for 8 modules per day on gantry
Electronic test (8 pieces / 70 min) / wire bonding (8 pieces / 3.3 hr) / encapsulation (8 pieces / 4 hr) can be done parallel
HV connector casuing noisy channels on partials

Can assembly 8 modules per day - next step is to start a second round of (proto)modules immediately after first round
Also tweaking biasing after each round and seeing improvements in offsets - consistent Y offset in production compared to dry runs for HBs, mostly because of no tape during dry runs
Guidance on applying transfer tape on HD HBs - we haven't had this issue for LD, but this was a good FYI
Epoxy dispensing rate is fairly constant after 13 mins (or 780 sec) from glue mixing. UCSB advises to mix glue 13 mins before dispensing. It takes them about 12 minutes to find fiducials. We don't have a time on autolocating fiducials yet. We can go back to using one syringe per round if this works. I have a lot of questions and will email Kai after the meeting.
Testing LD Full modules from CMU and TTU: need power adapter from Minnesota to finish
MMTS setup in progress - Alma 9 for PLC? No answer at the moment
Ti BPs have excessive glue in loading pin holes - be aware
Will add test data to central DB soon