HGC Management Meeting

Chat about slides:

• Projection in P6… doesnt know there is a delay
• Unresolved technical issue… what will happen
• Assert a t0 … Give my estimates.
• Critcical path wrt 50%
• [X] Ping Steve for critcal path… CR
• Future
  • Production Monitor: https://hgcal-production-vis.docs.cern.ch/overview.html

HGC Index

• Turn around reports

• Preparing for the review

HGC Slides for July 2026 Review

• [X] CMS Index

• templates
• All progress since last review
• Draft talks in 2 weeks

PWD: uscms_ipr26

2nd baseplate issue:

• IHEP CuW: vendor is reporting using a different glue…

What are CTE Mismatches?

CTE = Coefficient of Thermal Expansion — a measure of how much a material expands or contracts per degree of temperature change (typically expressed in ppm/°C or 10⁻⁶/°C).

## The Core Problem

When you bond/sandwich different materials together, each material wants to expand or contract by a different amount when temperature changes. Since they're physically joined, they can't move freely — this creates mechanical stress.

``` Heating up: Material A (high CTE) → wants to expand a LOT Material B (low CTE) → wants to expand a LITTLE

Result: shear/tensile stress at the interface ```

## Why It Matters

The mismatch (ΔCTE) drives stress proportional to:

``` stress ∝ (CTE<sub>A</sub> − CTE<sub>B</sub>) × ΔTemperature ```

Consequences of large mismatches:

• Warping / bowing (bimetallic strip effect)
• Delamination (layers peeling apart)
• Cracking of brittle layers
• Fatigue failure under thermal cycling

## Common Examples

Application	Materials	Concern
PCBs / chip packaging	Silicon (~3 ppm/°C) on substrate (~17 ppm/°C)	Solder joint cracking
Coatings	Metal + ceramic coating	Spalling
Optics	Glass + metal mounts	Stress birefringence, fracture
Composites	Fiber + matrix	Microcracking

## Typical CTE Values (ppm/°C)

• Silicon: ~2.6
• Glass (borosilicate): ~3.3
• Alumina: ~7
• Steel: ~12
• Copper: ~17
• Aluminum: ~23

## Mitigation Strategies

• Choose materials with matched CTEs
• Use intermediate buffer layers (graded CTE)
• Add compliant/flexible interlayers to absorb strain
• Design for stress relief (slots, flexures)
• Limit operating temperature range

• Getting data from

https://monit-grafana.cern.ch/d/dfebvcpfhd9tsd/si-modules-and-components-inventory?orgId=123&refresh=5m

CMU: 28/127 —> 22% of l157 50-> 75% l170 50-> 75% UCSB: 185 –> 120 + 32 FSE = 152 = 86 (finished 9-16%) 66 (8% start 17-32%) BLRT: 65 Full/5: 120

• 323 CMU
• 427 TTU
• 600 UCSB ~ 400 FSE
• 1150

https://docs.google.com/spreadsheets/d/1aEatPnCpuBV_LjC8gObXAvKJavUrhug99A9glgR98_4/edit?gid=1272782334#gid=1272782334

• TTU: 200+ Ti plates are unusable
• Finished CuW today
• QC at the
• Our baseplates also have kapton coming off relatively easily !

Could it be the Controller… ?… Appears the answer is yes.

CAM Turnaround Report

• Had 228. 292 =-> Complete 240 … + 52 + 10 (modules from end March)
• CMU + 62 / (4240*0.03) = 62/ 127.2 = 49%

Completed: l 153 ECM-Assemble and test module 81-240 at Site 2 Started l157 ECM-Assemble and test standard modules at Site 2 (5% - 8%) Started l169 ECM- Supervise assembly and testing of modules at Site 2 (5% - 8%)

UCSB: + (33 + 20+ 19+4+3+2+5)*0.5 + 6 = 50

• Had: 4908* 0.09 + 4908*0.09* 0.25 = 441.72 + 110.43 = 552 Now … 602

  100

l197 ECM-Assemble and test full-size equivalent odd-sized modules (9% - 16%) -> 75% l203 ECM- Supervise assembly of full-size equivalent odd-sized modules (9% - 16%) -> 75%

l156 5% Completion review … Finished

• FNAL progress review last week in July
• schedule workshop in May 5-6
• Based on what we have in the end of May
• GOAL: is to be just above the depletion
  • highest volatages 300 LD

• Posters for USCMS in Maryland in June

CAM Turnaround Report

l111 SM21360 ECM: Commission module teststands for production (module sites) 75% -> 80%

l157 SM40170 ECM-Ship module 1 to 80 from Site 2 to Cassette Assembly Site -> 70% l158 SM40180 ECM-Assemble and test module 81-240 at Site 2 -> 95% l159 SM40190 ECM- Supervise assembly and testing of modules 81-240 at Site 2 To 95%

l200 SM60870 ECM-Assemble and test full-size equivalent odd-sized modules (17% - 32%) 25-> 65% l211 SM61070 ECM-Ship odd-sized modules from UCSB to Cassette Assembly Sites (1% - 8%) -> 40%

Modules assembled at CMU during 2026/3 –

Total: 67 / 4240 = 1.5% 67/160 = 42%

Modules assembled at UCSB during 2026/3 –

Total: 140 / 4908 = 2.9 % 140 / 343.56 = 0.41

• 200um CuT Modues to CERN before end of the month

CAM Turnaround Report

CMU:

Total: 4240

• 40 loop back
• 24 lv adapters
• Project review end of July

• Modules
  • Absolute number of modules for preproduction plates (l47 ) is small
  • Colling plates in April
  • 46 and 47 are teh two last layers
  • CT shippment has been picked up … so some movement.

l165 SM40140 ECM-Assemble and test module 1-80 at Site 2

l203 ECM-Assemble and test full-size equivalent odd-sized modules (1% - 8%) l209 ECM- Supervise assembly of full-size equivalent odd-sized modules (1% - 8%)

• Need to order HV wiring

CAM Turnaround Report

• UCSB: 46 Modules since 9/26

l200 SM60850 ECM-Assemble and test full-size equivalent odd-sized modules (1% - 8%) Move to 20%\ l205 SM60940 ECM- Supervise assembly of full-size equivalent odd-sized modules (1% - 8%) Move to 20%

Close: ECM: International partner produces base plates Batch 1 Close: ECM: International partner delivers base plates Batch 1 Close l68 ECM: Ship PCB batch 1 to module assembly sites

Do we have a power distribution board? LV: 1.8 V supply

• The modules flattened after cooling
• Check them for noise
• Keep modules until we have done the thermal cycling on them

• Turnaround report
  • l 121 402W.04.04.02.04 CE - Module Site 3 SM61430 ECM: Procurement of final module factory tooling for UCSB marked done: Moving 194 ECM-Assemble and test full-size equivalent odd-sized modules (1% - 8%) to 15% Moving 199 SM60940 ECM- Supervise assembly of full-size equivalent odd-sized modules (1% - 8%) to 15%
• 100 Ti fulls to TTU and CMU
• Check out valves: flow limiters / flow restriction
• Serial flow
• Thermal P60

• Chambers have been picked up some time ago… not alot of details about where they are (No number)
• Shelves not yet sent.
• Steps in baseplates and TIB

• Ship modules to TTU for thermal cycling ? and UCSB…
• TTU got baseplates
• Looks like none sent to CMU

l159: 44->56%

• Buy the boxes !
• PCBs wait until the reentry
• UCSB will probably build modules in September

• Working on July CAM Turnaround Report
• Shelves being machined at CERN
• Box and shelves coming seperately
• Closed out: lines associated with chiller and teststand electronics: line 94 and 95, 102, 106, 110
  • Also did 100
• UCSB: four more
• Zoltan wants modules

• CuT incoming ? 1-2 months out
• 8 Krias coming from CERN

• Need more trophys
• Should empty them and ship back.
• Talk with Dave to see turn around on the hexabord crates.
• [X] Follow up with Alabama
• In short-term will get trophy only connectors: components on mezzine cards
• Check with Matt about tropy
• No meeting next week

• Filling out CAM Turnaround Report for June
• l127 End ECM: Delivery of High Voltage Power Supply and Dry Air Supply SM61520
• l135 Advance to 40% SM23190 ECM: Purchase of shipping cases for UCSB Site
• Nothing else unfortunately…

• Start l127: ECM: Delivery of High Voltage Power Supply and Dry Air Supply to 50%
• CAM Turnaround Report
• Harry assembled 30/60 Krias No fan.
• No SD cards
• Pinged Andrew re:buying fewer boxes

• Start l127: ECM: Delivery of High Voltage Power Supply and Dry Air Supply to 50%

• Chatting about presentations
• HGC Slides for June 2025 Review

• Chatting about the travel
• Risks

https://indico.cern.ch/event/1545898/

• Turn around report
• CAM Turnaround Report
• Do we start 142 ?
• Complete 152
• Move along: 155 50 -> 75%
• Move along 156: 80->90%
• What is l157 ?
• move along 182: 37->44
• Move along 183 37 -> 44
• Move along 184 20->30 %
• Move along 205 -> 5->7%

• South Dakota losing their grant unless they comply with 15% overhead
• 2 chiller boxes shipped each week

• Tariff discussion
• Discussed spare bond head … kick the can down the road

• Moves:
• l140 SM61440 ECM: Procurement of final module factory tooling for Site 2 (80 -> 90%)
• l143 SM61430 ECM: Procurement of final module factory tooling for UCSB (10->50%)
• l170 SM40140 ECM-Assemble and test module 1-80 at Site 2 (25->37%)
• l171 SM4015 ECM- Supervise assembly and testing of modules 1-80 at Site 2 (25->37%)
• l172 SM40170 ECM-Ship module 1 to 80 from Site 2 to Cassette Assembly Site (start )
• l189 SM50180 T5 - Start of Module Production (UCSB) (start)
• l190 SM50210 ECM: Cleanroom consumables (UCSB)
• CMU Modules per Month
• UCSB Modules per Month

• https://indico.cern.ch/event/1531110/
• [>>] Need to start filling in the slide template (2 weeks)
• Give the percentage change in labor
• Reference to the docDB area for BoE … Have not produced a BCR b/c the estimate is close … impact … Strong confidence complete with in projected budget.
• L2 is only LoE
• [>>] Update the docs

• Short and sweet
• Office of project assessment at FNAL
• Estimate to complete important

• CAM Turnaround Report

• February: https://docs.google.com/spreadsheets/d/1x2T8XBT7KlkrZQSe6N11ma8kYnd12xEX3ZnBwEVq2Pw/edit?gid=534403764#gid=534403764

• Need expect finish l119-122, 125: module teststand

• Advance L134: 10% -> 40% Start L135: ECM: Purchase of shipping cases for UCSB Site 10% L136: ECM: Procurement of final module factory tooling for Site 2 10% -> 80% Start L139: ECM: Procurement of final module factory tooling for UCSB -> 10% Advance L140 ECM: Oversee the procurement of the final module factory tooling -> 80%
• Module Assembly Site2 Advance L164 ECM-Assemble and test module 1-80 at Site 2 -> 25%

• l129: SM23180 ECM: Purchase of shipping cases for Site 2 10% -> 50%
• L131 SM61440 ECM: Procurement of final module factory tooling for Site 2 10->50% l157: ECM-Assemble and test module 1-80 at Site 2 L158 ECM- Supervise assembly and testing of modules 1-80 at Site 2
• Steve leading discussion
  • Looking at total float

• Need monthly counts of how many modules we produce
• Clarify plan with Joe / Suzzane
• Progress Review: DOE wants annual progress reviews.
• W-F April 23-25 DR / June 2-6

• https://docs.google.com/spreadsheets/d/1xKAJivTT7h8V_19VESxchGj72AXIC5QdW3N6lRbtnqQ/edit?gid=1245728450#gid=1245728450
• Module assembly at CMU

• Moves: l81: ECM: Test standard PCB batch 1 (First 5%) to 20% l157: ECM-Assemble and test module 1-80 at Site 2 l158 ECM- Supervise assembly and testing of modules 1-80 at Site 2
• From Barney:
  • I strongly suggest you follow the P2UG presentations by HGCAL that happen 1-2 times per year, as this sort of thing is always mentioned. You can look at Paul's presentation at the November P2UG ([https://indico.cern.ch/event/1471927/contributions/6197528/attachments/2959391/5207889/HGCAL%20Electronics%20P2UG%205Nov24.pdf](https://indico.cern.ch/event/1471927/contributions/6197528/attachments/2959391/5207889/HGCAL%20Electronics%20P2UG%205Nov24.pdf)) for a reasonable summary of the status of the Hexaboards. 
• Since November:
  • about 1500 more LD Full Hexaboards received at CERN (bare). Visual inspection done on a sampling basis - all very good
  • 60 LD Full assembled with HGCROC3C before Christmas and tested recently: look good (with the provisos of 3C of course)
  • Orders placed with an assembly company (one we know well) for assembly of another ~900 boards - mostly Full, but also some partials - to get the MACs producing modules for the pre-series cassettes and to prove (again on a sampling basis) that the batches of PCBs are ok. These assemblies should all be done with 3C. 
  • Invitations to Tender for mass assembly will be launched at the end of this week, with mass assembly then due to start around April/May

• CAM Reporting
  • Moved baseplates to 15% (lines: 64 and 65)
    • Baseplates: 8 + 34
    • Batch 1 = 240 modules/
    • Module assembly at CMU
  • Start 74 ECM:Vendor delivers assembled standard PCB batch 1 (First 5%)
    • HAve 48 hexaboards
  • Start 78 ECM: Test standard PCB batch 1 (First 5%)
  • Start 81 ECM: Snhip PCB batch 1 to module assembly sites
  • Start 106? (Have Kria at CMU!)
  • Start 149 150
  • close 116 / 123
  • Added expected for 149 and 150
• Follow up with Dave
  • is the bae PCB proceeding ? (order out for a while)
  • assembly still underway
• CAM Turnaround Report
• https://docs.google.com/spreadsheets/d/12NhkWpOrwotOBbPfx21_r1S_-IWLX1YuRGmjqPmBb_0/edit?gid=1225274733#gid=1225274733
• MAC meeting 18 December 2024

• ** BCR

  • There are overheads ~20% but vary by University (which is why my numbers arent identical)
  • https://indico.cern.ch/event/1356090/contributions/5710303/attachments/2768555/4823054/MMStand-ShoppingList.pdf
  • from https://indico.cern.ch/event/1356090/
  • https://vastitec.com/en/products-2/safety-2/high-voltage-switching-system/
  • https://www.tek.com/en/products/keithley/source-measure-units/2400-standard-series-sourcemeter
  • Ping Rong Shoang about mimimum requirements
  • Ping Joe and Nural about HV 2410

  [>>] (HGC Transfer Tape BCR)

• connected at the end
• discussion of if we can store module is ambient air

• HGC MAC BoEs
• Turnaround: https://docs.google.com/spreadsheets/d/1wmcJ2myS0LIQdlsP8n9IuCanh3bSH0BrJ9gDTFIXmoU/edit?gid=1373113300#gid=1373113300
• Krias coming to the MACs
  • 1 unit
  • 5 units/MAC in March
• No schedule for the Trophies https://fbcr.fnal.gov/Account/Login?ReturnUrl=%2FBCR%2FAll https://fbcr.fnal.gov/BCR/All

• Our meeting today will focus on the risk register, where we need to take

a number of actions, and the planning of a set of BCRs which we need to attack to be able to properly budget for production as well as to defend our plans during the DOE progress review in June.

• Progress Review in Directors Review in April and DOE Project review in June
• ** BCR

• HGC Transfer Tape BCR
• Dry Air for MMTS

• Making Moves!
• [>>] Need to ship modules to FNAL
• Turn around report: https://docs.google.com/spreadsheets/d/1_n3haNSgdGix-USM7QhdwhWFtRAPt12EgQ8hgiNsBP4/edit?gid=843171142#gid=843171142

• ** Making Moves Ending preseries

  Finished lines

  • l67? ECM: Update base plate design for production modules
  • l68 ? T4 - Ready for base plates production
  • l69: ECM: Vendor produces preseries partial module base plates
  • l73: ECM: Vendor delivers preseries partial module base plates
  • l74: ECM: Qualify base plates for production
  • l75: ECM: Qualify partial module base plates for production
  • 176: ECM: Ship base plates to module assembly sites for preseries production

  started:

  • l70? ECM: International partner produces base plates Batch 1

Should start ?

• l130 ECM: Procurement of final module factory tooling for Site 2
• l134 ECM: Procurement of final module factory tooling for UCSB
• l128 T5 - ECM - Site 2 Ready for Module Construction

• ** Nural placed order for chillers
  • is done!
  • 5 POs
  • coolant
  • Shipping date ?
  • Dimensions of the chiller?

• ** Cost on Shipping Foam? $5523.00.
• ** Plan to send to 20 send by end of the month.
  • Get shipping address from Don

• ECON-D has a problem in the SRAM (Static Random-Access Memory)
• ECON-T doesnt have any SRAMs

Karl wanted a workshop at FNAL

• When cassette was ready, people would come to work on it.
• Karl wanted to have it any way.
• "Site visit" managers DESY and CERN
• Date Nov 11-15th

• https://docs.google.com/spreadsheets/d/1z-ugaRIo4SszJzNrT5N7ddWe7vlk615xH2ospkZQoS4/edit?gid=983055628#gid=983055628
• Motherboard updates: will produce some LD engines (have PCBs) only enough to get started, while we figure out lpgt situation. (~100)
• HD wagon back, starting to work on
• LD wagon pretty advanced, PCB order soon (limited until Dec. b/c wag side of engine <-> wagon supply delay)
• Modules Baseplates… 22nd 23rd. 29th
• Who to bug about baseplates?
• Propose to finish l163 (odd-size preseries)
• Need to mark completed in tab "Comp Status-DOE"

• Engine problem, which chips not getting the clock
• Monday Management meeting ?

Session to exchange news.

• Chiller
• Order placed for shipping material now
• Tooling will be ordered soon
  • Xometry designs with interface at FNAL

• CMU Marked 100% for Preseries
• Mitchell Wayne (Notre Dame) https://physics.nd.edu/people/mitchell-wayne/
• Need to mark completed in tab "Comp Status-DOE"
• https://docs.google.com/spreadsheets/d/1uuUD5JkIhXx8zDhtWwWRrfelDgBqR3iYWHE5NqkY5iU/edit?gid=1977079858#gid=1977079858

• Tiles and cassettes
• no meeting next week

• https://docs.google.com/spreadsheets/d/18x4XODPDE1Q-YTiqNDS7HqFDF8a3Gk1TseSsIlZoDKY/edit?gid=769445715#gid=769445715

• Racheal to send CMU ~125 sensors next week.
• We need 300 micron LD partials early
• The HD partials see the most radiation and will need the best componets to survive.
• ROC v3-b is the chip with probems
• v3-c
• LD require 3 chips / module
• HD require 6 chips / module
• Might be possible for v3-d
• BCR: everything outside freeze to sit on working schedule dates

Data base and labeling discussion

Local DB working well:

• Need to understand how often to upload to the global DB
• Need to finalize info to be stored

• Baseplate updates